Abstract
Having withstood the tests of time, ceramic materials are truly the materials of the ages. Artifacts made of ceramics have been identified with early civilizations that existed thousands of years ago. The durability of these ceramic materials has allowed them to bridge the gap between ancient and modern times. Basic durability sets ceramic materials apart, and is the primary characteristic that will guarantee them a place in the future.
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References
W. D. Kingery, H. K. Bowen, and D. R. Uhlmann. Introduction to Ceramics, 2nd ed. John Wiley & Sons, New York, 1976.
L. H. Van Vlack. Physical Ceramics for Engineers. Addison-Wesley Publishing Co., Reading, MA, 1964.
R. E. Grim. Clay Mineralogy. McGraw-Hill Book Co., New York, 1953.
G. W. Morey. The Properties of Glass, 2nd ed. Reinhold Publishing Co., New York, 1954.
M. Grayson. Encyclopedia of Glass, Ceramics, and Cements. John Wiley & Sons, New York, 1985.
E. B. Sands. Class Engineering Handbook, 2nd ed. McGraw-Hill Book Co., New York, 1958.
L. Pauling. Nature of the Chemical Bond. Cornell University Press Ithaca, NY, 1945.
G. C. Phillips, R. Sanwald, and J. F. Cain, “Modern Techniques Reveal Ceramics” Industrial Research, 16(13): 46–50, December 1974.
D. W. Richerson. Modern Ceramic Engineering. Marcel Dekker Inc., New York and Basel, 1982.
G. C. Phillips and J. F. Turner, “Characterization of Thin Film Copper Circuits on Various Ceramic Surfaces,” Proc. 31st Electronic Component Conference, Atlanta, 1981.
G. C. Phillips, “Fractography of Metalized Ceramic Substrates,” ASTM Special Technical Publication 827, 1984.
L. Orr, “Practical Analysis of Fractures in Glass Windows,” Mater. Res. Stand. 12(1d): 21–23, 47, 1972.
H. P. Kircnner and R. M. Gruver, “Fracture Mirrors in Alumina Ceramic Ceramics,” Philos. Mag. 26(6): 1433–46, 1973.
J. E. Hove and W. C. Riley, Ceramics for Advanced Technologies, John Wiley & Sons, New York, 1965.
J. E. Hove and W. C. Riley, Modern Ceramics—Some Principles and Concepts, John Wiley & Sons, New York, 1965.
G. C. Phillips, “Planar Pin Grid Arrays Ceramic Packaging,” Proc. 38th Electronic Components Conference, Los Angeles, 1988.
B. Schwartz, “Microelectronic Packaging: II,” Am. Ceramic Bulletin, 63(4): 577–81, 1984.
R. R. Tummala, “Ceramics in Microelectronic Packaging,” Am. Ceramic Bulletin, 67(4): 752–58, 1988.
A. J. Blodgett, “A Multilayer Ceramic Multichip Module,” IEEE Trans, on Components, CHMT-3(4): 634–37, 1980.
B. T. Clark, “IBM Multichip Multilayer Ceramic Modules for LSI Chips,” IEEE Trans., CHMT-3 No. (1): 5–8, 1980.
W. H. Zachariasen “The Atomic Arrangment in Glass,” J Am Chem Soc. 54,3841 (1932).
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© 1991 Van Nostrand Reinhold
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Phillips, G.C. (1991). The Future of Ceramics. In: A Concise Introduction to Ceramics. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6973-8_20
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DOI: https://doi.org/10.1007/978-94-011-6973-8_20
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