Abstract
In this paper, we propose a rapid update approach of a global stiffness matrix for a binary online re-mesh and multi-rate finite element deformation simulation. Our approach enables us to generate realistic and stable reaction force and deformation with quick movement such as stick slip phenomenon. In early evaluative experiments, we can confirm that our approach contributes to the reduction of computational cost of deformation simulation.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
References
Paloc, C., Faraci, A., Bello, F.: Online remeshing for soft tissue simulation in surgical training. IEEE Comput. Graphics Appl. 26, 24–34 (2006)
Debunne, G., Desbrun, M., Cani, M.P., et al.: Dynamic real-time deformations using space and time adaptive sampling. In: Proceedings of ACM SIGGRAPH’01, pp. 31–36 (2001)
Tagawa, K., Sasaki, Y., Tanaka, H.T.: Online re-mesh and multi-rate deformation simulation by GPU for haptic interaction with large scale elastic objects. In: Proceedings of IEEE Haptics, pp. 531–538 (2012)
Grimes, R., Kincaid, D., Young, D.: ITPACK 2.0 User’s guide. Technical Report CNA-150, Center for Numerical Analysis, University of Texas (1979)
Courant, R., Friedrichs, K., Lewy, H.: On the partial difference equations of mathematical physics. IBM J., 215–234 (1967)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2018 Springer Nature Singapore Pte Ltd.
About this paper
Cite this paper
Kuriki, R., Tagawa, K., Tanaka, H.T., Komori, M. (2018). A Fast Update Approach of a Stiffness Matrix for a Multi-rate Finite Element Deformation Simulation. In: Hasegawa, S., Konyo, M., Kyung, KU., Nojima, T., Kajimoto, H. (eds) Haptic Interaction. AsiaHaptics 2016. Lecture Notes in Electrical Engineering, vol 432. Springer, Singapore. https://doi.org/10.1007/978-981-10-4157-0_44
Download citation
DOI: https://doi.org/10.1007/978-981-10-4157-0_44
Published:
Publisher Name: Springer, Singapore
Print ISBN: 978-981-10-4156-3
Online ISBN: 978-981-10-4157-0
eBook Packages: EngineeringEngineering (R0)