Abstract
The microstructure and properties of spray-formed Si–30Al alloy was studied in this paper, which was used for electronic packaging. Hot isostatic pressing was used to compact the ingot, and then electroplating and brazing was carried out. The results showed that, (1) the Si–30Al alloy comprised α-Al phase, pseudo eutectic phase and primary silicon phase; (2) the flow deformation of α-Al phase and pseudo eutectic phase filled pore defect making the alloy compacting by HIP; (3) the alloy could be electroplated and brazed easily, and no pore defect was observed in electroplated coating and weld.
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References
Zhang Jishan, New spray formed light weighted Si-Al Electromic Packaging materials with low thermal expansion and high heat conducting, Materials Review. 6 (1) (2002) 1–4.
Huang Qiang, Gu Mingyuan, Jin Yanping, Current status of research on electronic packing materials, Materials Review. 14 (9) (2000) 28–32.
D.R. Jerry, E. Sergent, Materials for multichip modules. Electronic Packaging & Production, 36 (12) (1996) 28–32.
S.P.S. Sangha, D.M. Jacobsom, A. Arun Junai, E. Botter, Novel aluminium-silicon alloys for electronics packaging, Engineering Science and Education Journal. 11 (1997) 195–201.
D.M. Jacobson, Lightweight electronic packaging technology based on spray formed Si-Al, Powder Metallurgy. 43 (3) (2000) 200–202.
D.M. Jacobson, Spray-formed silicon-alluminum, Advanced Materials & Processes. 3 (2000) 36–39.
D.M. Jacobson, S.P.S. Sangha, Novel low expansion packages for electronics, The GEC Journal of technology. 14 (1) (1997) 48–52.
S. Su, X. Liang, A. Moran, E.J. Lavernia, Solidification behavior of an Al-6Si alloy during spray atomization and deposition, Inter. J. Rapid solidification. 8 (1994) 161–165.
Acknowledgements
This study was financially supported by the National Key Research and Development Program of China (No. 2016YFB0300803 and No. 2016YFB0300903).
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Liu, H. et al. (2018). Microstructure and Properties of Spray-Formed Si–30Al Alloy Used for Electronic Packaging. In: Han, Y. (eds) High Performance Structural Materials. CMC 2017. Springer, Singapore. https://doi.org/10.1007/978-981-13-0104-9_10
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DOI: https://doi.org/10.1007/978-981-13-0104-9_10
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