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Polycrystalline Silicon Thin Film Transistors (Poly-Si TFTs)

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Handbook of Visual Display Technology

Abstract

Poly-Si TFTs are now in mass production for small diagonal displays, and, in this article, the fabrication and performance of these devices is discussed, with particular focus on the formation of poly-Si by excimer laser crystallization, the issues surrounding TFT architecture, and the performance artifacts associated with the high electrostatic field at the drain junction.

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Abbreviations

AMLCD:

Active Matrix Liquid Crystal Display

AMOLED:

Active Matrix Organic Light Emitting Diode

a-Si:H:

Hydrogenated Amorphous Silicon

DOS:

Density of States

ELA:

Excimer Laser Annealing

GOLDD:

Gate Overlapped Lightly Doped Drain

HCD:

Hot Carrier Damage

LDD:

Lightly Doped Drain

LPCVD:

Low Pressure Chemical Vapor Deposition

MOSFET:

Metal Oxide Semiconductor Field Effect Transistor

PECVD:

Plasma Enhanced Chemical Vapor Deposition

SLG:

Super-Lateral Growth

SOG:

System-On-Glass

SOI:

Silicon-on-Insulator

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Further Reading

  • Kagan CR, Andry P (2003) Thin film transistors. CRC Press, New York

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  • Kuo Y (2004) Thin film transistors: materials and processes – vol 2: polycrystalline silicon thin film transistors. Kluwer, Norwell

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Correspondence to S. D. Brotherton .

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Brotherton, S. (2012). Polycrystalline Silicon Thin Film Transistors (Poly-Si TFTs). In: Chen, J., Cranton, W., Fihn, M. (eds) Handbook of Visual Display Technology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-540-79567-4_48

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