Skip to main content
SpringerLink
Log in

A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package

  • Article
  • Published:
Chinese Journal of Polymer Science Aims and scope Submit manuscript

Abstract

In this work, low-temperature vulcanized, transparent silane modified epoxy resins for LED filament bulb package were prepared. Firstly, transparent silane modified epoxy resins were produced through a controllable sol-gel method using γ-(2,3-epoxypropoxy)propytrimethoxysilane and dimethyldiethoxylsilane. The features of the reaction were investigated and the products were characterized in detail. Subsequently, various curing agents were explored to prepare transparent silane modified epoxy resins. The silane modified epoxy resins cured by PEA-230 at a fairly low temperature (40 °C/2 h then 60 °C/1 h) exhibited excellent thermal stability with a thermal degradation temperature as high as 316.5 °C and adjustable hardness between 40−60 shore A. The application tests showed the materials obtained were good candidates for LED filament bulb package.

This is a preview of subscription content, log in via an institution to check access.

Access this article

Log in via an institution

Price excludes VAT (USA)
Tax calculation will be finalised during checkout.

Instant access to the full article PDF.

Institutional subscriptions

Similar content being viewed by others

References

  1. Yang, S. C.; Kim, J. S.; Jin, J. H.; Kwak, S. Y.; Bae, B. S. Thermal resistance of cycloaliphatic epoxy hybrimer based on sol-gel derived oligosiloxane for LED encapsulation. J. Appl. Polym. Sci. 2010, 117(4), 2140–2145.

    Article  CAS  Google Scholar 

  2. Yang, X. F.; Shao, Q.; Yang, L. L.; Zhu, X. B.; Hua, X. L.; Zheng, Q. L.; Song, G. X.; Lai, G. Q. Preparation and performance of high refractive index silicone resin-type materials for the packaging of light-emitting diodes. J. Appl. Polym. Sci. 2013, 127(127), 1717–1724.

    Article  CAS  Google Scholar 

  3. Yang, X. F.; Yang, L. L.; Cao, C.; Zhu, X. B.; Hua, X. L.; Zheng, Q. L.; Song, G. X.; Wu, L. B.; Lai, G. Q. Preparation of a silicone resin-type packaging material with high refractive index for light emitting diodes. Chem. J. Chin. Univ. 2012, 33(5), 1078–1083.

    CAS  Google Scholar 

  4. Huang, J. C.; Chu, Y. P.; Wei, M.; Deanin, R. D. Comparison of epoxy resins for applications in light-emitting diodes. Adv. Polym. Technol. 2004, 23(4), 298–306.

    Article  CAS  Google Scholar 

  5. Bu, Z. Y.; Hu, J. J.; Li, B. G. Novel silicon-modified phenolic novolac resins: non-isothermal curing kinetics, and mechanical and thermal properties of their biofiber-reinforced composites. Thermochimica Acta 2014, 575(1), 244–253.

    Article  CAS  Google Scholar 

  6. Kumar, R. N.; Keem, L. Y.; Mang, N. C.; Abubakar, A. Ultraviolet radiation curable epoxy resin encapsulant for light emitting diodes. J. Appl. Polym. Sci. 2006, 100(2), 1048–1056.

    Article  CAS  Google Scholar 

  7. Zhang, Y. H.; Rhee, K. Y.; Park, S. J. Nanodiamond nanocluster-decorated graphene oxide/epoxy nanocomposites with enhanced mechanical behavior and thermal stability. Compos. Part B: Engineer. 2017, 114, 111–120.

    Article  CAS  Google Scholar 

  8. Yang, S. C.; Kwak, S. Y.; Jin, J. H.; Kim, J. S.; Choi, Y. W.; Paik, K. W.; Bae, B. S. Thermally resistant UV-curable epoxysiloxane hybrid materials for light emitting diode (LED) encapsulation, J. Mater. Chem. 2012, 22(18), 8874–8880.

    CAS  Google Scholar 

  9. Kim, J. S.; Yang, S. C.; Kwak, S. Y.; Choi, Y. W.; Paik, K. W.; Bae, B. S. High performance encapsulant for light-emitting diodes (LEDs) by a sol-gel derived hydrogen siloxane hybrid. J. Mater. Chem. 2012, 22(16), 7954–7960.

    Article  CAS  Google Scholar 

  10. Kim, J. S.; Yang, S. C.; Bae, B. S. Thermally stable transparent sol-gel based siloxane hybrid material with high refractive index for light emitting diode (LED) encapsulation. Chem. Mater. 2010, 22(11), 3549–3555.

    Article  CAS  Google Scholar 

  11. Rath, S. K.; Chavan, J. G.; Sasane, S.; Srivastava, A.; Patri, M.; Samui, A. B.; Chakraborty, B. C.; Sawant, S. N. Coatings of PDMS-modified epoxy via urethane linkage: Segmental correlation length, phase morphology, thermomechanical and surface behavior. Prog. Org. Coat. 2009, 65(3), 366–374.

    Article  CAS  Google Scholar 

  12. Huang, S. S.; Zhou, W. C.; Luo, F.; Zhu, D. M. Mechanical and dielectric properties of short-carbon-fibers/epoxy-modifiedorganic- silicone-resin as heat resistant microwave absorbing coatings. J. Appl. Polym. Sci. 2013, 130(130), 1392–1398.

    Article  CAS  Google Scholar 

  13. Sobhani, S.; Jannesari, A.; Bastani, S. Effect of molecular weight and content of PDMS on morphology and properties of silicone-modified epoxy resin. J. Appl. Polym. Sci., 2012, 123(1), 162–178.

    Article  CAS  Google Scholar 

  14. Ahmad, S.; Ashraf, S. M.; Sharmin, E.; Mohomad, A.; Alam, M. Synthesis, formulation, and characterization of siloxanemodified epoxy-based anticorrosive paints. J. Appl. Polym. Sci. 2006, 100(100), 4981–4991.

    Article  CAS  Google Scholar 

  15. Kumar, S. A.; Balakrishnan, T.; Alagar, M.; Denchev, Z. Development and characterization of silicone/phosphorus modified epoxy materials and their application as anticorrosion and antifouling coatings. Prog. Org. Coat. 2006, 55(3), 207–217.

    Article  Google Scholar 

  16. Ahmad, S.; Gupta, A. P.; Sharmin, E.; Alam, M.; Pandey, S. K. Synthesis, characterization and development of high performance siloxane-modified epoxy paints. Prog. Org. Coat. 2005, 54(3), 248–255.

    Article  CAS  Google Scholar 

  17. Wu, Q.; Zhang, C.; Liang, R.; Wang, B. Combustion and thermal properties of epoxy/phenyltrisilanol polyhedral oligomeric silsesquioxane nanocomposites. J. Therm. Anal. Calorim., 2010, 100(3), 1009–1015.

    Article  CAS  Google Scholar 

  18. Zhang, D. H.; Liang, E. B.; Li, T. C.; Chen, S. F.; Zhang, J. H.; Cheng, X. J.; Zhou, J. L.; Zhang, A. Q.. Environment-friendly synthesis and performance of a novel hyperbranched epoxy resin with a silicone skeleton. RSC Adv. 2013, 3(9), 3095–3102.

    CAS  Google Scholar 

  19. Zhang, D. H.; Liang, E. B.; Li, T. C.; Chen, S. F.; Zhang, J. H.; Cheng, X. J.; Zhou, J. L.; Zhang, A. Q. The effect of molecular weight of hyperbranched epoxy resins with a silicone skeleton on performance. RSC Adv. 2013, 3(24), 9522–9529.

    Article  CAS  Google Scholar 

  20. ASTM E313-10: Standard practice for calculating yellowness and whiteness indices from instrumentally measured color coordinates. ASTM, Book Standards 2010, 6, pp6. DOI: 10.1520/E0313–10

  21. Zhang, Y. H.; Choi, J. R.; Park, S. J. Thermal conductivity and thermo-physical properties of nanodiamond-attached exfoliated hexagonal boron nitride/epoxy nanocomposites for microelectronics, Compos. Part A: Appl. Sci. Manufactur. 2017, 101, 227–236

    Article  CAS  Google Scholar 

  22. Zhu, J.; Peng, H.; F. Rodriguez-Macias; Margrave J. L.; Khabashesku V. N.; Imam A.; Lozano K.; Barrera E. V. Reinforcing epoxy polymer composites through covalent integration of functionalized nanotubes. Adv. Funct. Mater. 2004, 14(7), 643–648.

    Article  CAS  Google Scholar 

  23. Zhang, Y. H.; Park, S. J. In situ modification of nanodiamonds by mercapto-terminated silane agent for enhancing the mechanical interfacial properties of nitrile butadiene rubber nanocomposites. Polym. Comps. 2017, DOI: 10.1002/pc.24367

    Google Scholar 

Download references

Acknowledgments

The authors are grateful for financial support from the Zhejiang Provincial Natural Science Foundation of China (No. Y14E030008), the Commonweal Technology Application Research Project of Zhejiang Province (No. 2013C31079).

Author information

Authors and Affiliations

  1. Key Laboratory of Organosilicon Chemistry and Material Technology of Ministry of Education, Hangzhou Normal University, Hangzhou, 311121, China

    Xiong-Fa Yang, Jia Liu, Qiong Chen, Yan-Ping Shen & Guo-Qiao Lai

  2. School of Chemistry and Chemical Engineering, Shandong University, Jinan, 250100, China

    Xiong-Fa Yang & Hong-Zhi Liu

Authors
  1. Xiong-Fa Yang
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Jia Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  3. Qiong Chen
    View author publications

    You can also search for this author in PubMed Google Scholar

  4. Yan-Ping Shen
    View author publications

    You can also search for this author in PubMed Google Scholar

  5. Hong-Zhi Liu
    View author publications

    You can also search for this author in PubMed Google Scholar

  6. Guo-Qiao Lai
    View author publications

    You can also search for this author in PubMed Google Scholar

Corresponding authors

Correspondence to Xiong-Fa Yang or Guo-Qiao Lai.

Electronic supplementary material

Rights and permissions

Reprints and permissions

About this article

Check for updates. Verify currency and authenticity via CrossMark

Cite this article

Yang, XF., Liu, J., Chen, Q. et al. A Low Temperature Vulcanized Transparent Silane Modified Epoxy Resins for LED Filament Bulb Package. Chin J Polym Sci 36, 649–654 (2018). https://doi.org/10.1007/s10118-018-2028-8

Download citation

  • Received:

  • Accepted:

  • Published:

  • Issue Date:

  • DOI: https://doi.org/10.1007/s10118-018-2028-8

Keywords

Search

Navigation