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Cold isostatic pressing of screen-printed dielectric for power electronics passive component integration

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Abstract

This paper focuses on the study of high-capacitance embedded capacitors for power electronics applications, manufactured by the screen-printing technique. Thick film ferroelectric ceramic was printed on Ag/Al2O3 substrates and dried at 120 °C, then a pre-treatment was applied by cold isostatic pressing (CIP) before sintering. A comparison of the physico-chemical and electrical properties of the non-CIP and CIP samples is made. The results show that the thick film samples pre-treated by CIP have higher permittivity and higher dielectric strength compared to the untreated ones. The capacitor samples with CIP pre-treatment also exhibit higher capacitances, lower parasitic equivalent series inductance and series resistance; all key intrinsic dielectric properties relevant for applications. We propose the use of this process for obtaining the embedded capacitors that allow for high-capacitance values for decoupling and filtering in power electronics applications.

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Authors and Affiliations

  1. UPS, INPT, LAPLACE (Laboratoire Plasma et Conversion d’Energie), Université de Toulouse, 118 route de Narbonne, 31062, Toulouse Cedex 9, France

    Thi Bang Doan, Thierry Lebey, Thierry Meynard & Zarel Valdez-Nava

  2. CNRS, LAPLACE, 31062, Toulouse, France

    Thi Bang Doan, Thierry Lebey, Thierry Meynard & Zarel Valdez-Nava

  3. IES (Institute of Electronics and Systems), University of Montpellier 2, Montpellier, France

    François Forest

Authors
  1. Thi Bang Doan
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  2. Thierry Lebey
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  3. François Forest
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  4. Thierry Meynard
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  5. Zarel Valdez-Nava
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Correspondence to Zarel Valdez-Nava.

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Doan, T.B., Lebey, T., Forest, F. et al. Cold isostatic pressing of screen-printed dielectric for power electronics passive component integration. J Mater Sci: Mater Electron 26, 2493–2500 (2015). https://doi.org/10.1007/s10854-015-2711-2

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  • DOI: https://doi.org/10.1007/s10854-015-2711-2

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