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Electroless Deposition Approaching the Molecular Scale

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Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications

Abstract

Electroless deposition (ELD) encompasses quite a range of chemical deposition processes at the solid/liquid interface. Here I focus exclusively on autocatalytic ELD of metals, i.e., the plated metal catalyzes its own deposition, and hence the process is continuous as long as sufficient amounts of reactants are provided [1–5]. Such a reaction requires a catalytic site to start; usually this is a noble metal nanoparticle, while for technical applications mixed metal particles are employed. Obviously, the size of the nanoparticle must be smaller than the desired metal structure. The theoretical limit for common electroless Cu plating baths is in the atomic range, and indeed clusters with two or four atoms may act as nuclei; the smallest electroless (EL) metal structures are in the range of 2 nm (corresponding to several hundred atoms) [6–7].

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Authors and Affiliations

  1. Group leader “Self-Assembly” Asociacion CIC nanoGUNE Tolosa Hiribidea, 76, 20018, Donostia – San Sebastian, Spain

    A.M. Bittner

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Correspondence to A.M. Bittner .

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Editors and Affiliations

  1. Tel Aviv University, Ramat Aviv, Tel Aviv, 69978, Israel

    Yosi Shacham-Diamand

  2. Dept. Applied Chemistry, Waseda University, Okubo 3-4-1 , Tokyo, 169-8555, Japan

    Tetsuya Osaka

  3. Emerson Network Power, Cooligy Precision Cooling, Maude Avenue 800, Mountain View, 94043, U.S.A.

    Madhav Datta

  4. Division of Corporate Relations, The University of Tokyo, Hongo 7-3-1, Tokyo , 113-8654, Japan

    Takayuki Ohba

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Bittner, A. (2009). Electroless Deposition Approaching the Molecular Scale. In: Shacham-Diamand, Y., Osaka , T., Datta, M., Ohba, T. (eds) Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications. Springer, New York, NY. https://doi.org/10.1007/978-0-387-95868-2_15

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