Abstract
Chapter 5 reports on the application of FEA modeling and simulation techniques used for design of package assembly design for reliability. FEA modeling techniques have been developed for three-dimensional models, sub-modeling, and global–local modeling techniques. The global–local 3D modeling techniques like sub-modeling and Global–Local-Beam (GLB) methods, were applied to model solder joint reliability behavior for various test cases of thermal cycling, vibration, and impact drop tests. Implementation of the nonlinear mechanics of materials models have been integrated to the ANSYS finite element analysis program.
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Pang, J.H.L. (2012). Finite Element Analysis and Design-for-Reliability. In: Lead Free Solder. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0463-7_5
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DOI: https://doi.org/10.1007/978-1-4614-0463-7_5
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