Abstract
Chapter 6 reports on solder joint reliability test case studies for thermal cycling tests. Thermal cycling test and FEA of lead-free solder PCB assemblies for BGA and FCOB test specimens were evaluated to determine the Weibull cumulative failure distribution. Finite element modeling and simulation of this reliability test was employed to predict the solder joint reliability performance. Experimental study was conducted on lead-free 95.5Sn–3.8Ag–0.7Cu soldered assemblies provided by Solectron Technology [8]. The test variables include different packages (PBGA, PQFP) and different PCB board surface finishes on copper pads (Cu-OSP, ENIG, and Im-Ag). FEA modeling of the PBGA assembly with 95.5Sn–3.8Ag–0.7Cu solder joints and fatigue analysis was applied to predict the solder joint mean-time-to-failure life cycles. Failure analysis investigation on intermetallic compound or IMC layer growth subject to isothermal aging, thermal cycling, and thermal shock aging experiments were conducted to correlate IMC layer growth properties in lead-free 95.5Sn–3.8Ag–0.7Cu solder joint specimens. Highly Accelerated Life Test (HALT) approaches were also developed for lead-free 95.5Sn–3.8Ag–0.7Cu soldered PCB assemblies.
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Pang, J.H.L. (2012). Thermo-Mechanical Reliability Test and Analysis. In: Lead Free Solder. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-0463-7_6
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DOI: https://doi.org/10.1007/978-1-4614-0463-7_6
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