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The Multi GPU Accelerated Waveform Inversion in Distributed OpenCL Environment

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Emerging Trends in Computing, Informatics, Systems Sciences, and Engineering

Part of the book series: Lecture Notes in Electrical Engineering ((LNEE,volume 151))

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Abstract

Seismic waveform inversion is a problem with demand of high computational power. This demand can be fulfilled by supercomputers or by the modern graphics units. However GPU solution is much more accessible and cheaper. To implement this problem on GPUs one of GPGPU environments should be used. The newest one is OpenCL. To obtain higher speedup the MPI technology and additional graphic units can be used. Tests in such an environment were performed and results are presented and discussed in the following paper.

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References

  1. Sen M (2006) Seismic inversion. Society of petroleum engineers

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  2. Tarantola A (2005) Inverse problem theory and methods for model parameter estimation. SIAM

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Acknowledgments

This work was financed by the AGH−University of Science and Technology, Faculty of Geology, Geophysics and Environmental Protection as a part of statutory project number 11.11.140.561.

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Authors and Affiliations

  1. Department of Geoinfomatics and Applied Computer Science, AGH University of Science and Technology, Cracow, Poland

    M. Kloc & T. Danek

Authors
  1. M. Kloc
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  2. T. Danek
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Corresponding author

Correspondence to T. Danek .

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Editors and Affiliations

  1. School of Engineering, University of Bridgeport, University Avenue 221, Bridgeport, 06604, Connecticut, USA

    Tarek Sobh

  2. School of Engineering, University of Bridgeport, University Avenue 221, Bridgeport, 06604, Connecticut, USA

    Khaled Elleithy

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© 2013 Springer Science+Business Media New York

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Kloc, M., Danek, T. (2013). The Multi GPU Accelerated Waveform Inversion in Distributed OpenCL Environment. In: Sobh, T., Elleithy, K. (eds) Emerging Trends in Computing, Informatics, Systems Sciences, and Engineering. Lecture Notes in Electrical Engineering, vol 151. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-3558-7_19

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  • DOI: https://doi.org/10.1007/978-1-4614-3558-7_19

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-3557-0

  • Online ISBN: 978-1-4614-3558-7

  • eBook Packages: EngineeringEngineering (R0)

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