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Thermal Reliability Tests

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Copper Wire Bonding

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Abstract

This chapter covers the thermal reliability tests conducted on Cu wire bonds. High-temperature storage (HTS) tests on Cu and PdCu wires on Al-, Au-, and Ni-based pads are discussed, and reliability test data are provided. Comparisons are made between the HTS strengths of Cu and PdCu wires. The effect of HTS on Pd distribution, as well as its effect on wire bond strength, is discussed. Cu wire bond reliability under thermal cycling and thermal shock testing is also presented.

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Authors and Affiliations

  1. Center for Advanced Life Cycle Engineering (CALCE), University of Maryland, College Park, MD, USA

    Preeti S. Chauhan & Michael G. Pecht

  2. Industry Consultant, Marlborough, MA, USA

    Anupam Choubey

  3. School of Mechanical & Aerospace Engineering, Nanyang Technological University, Singapore, Singapore

    ZhaoWei Zhong

Authors
  1. Preeti S. Chauhan
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  2. Anupam Choubey
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  3. ZhaoWei Zhong
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  4. Michael G. Pecht
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Chauhan, P.S., Choubey, A., Zhong, Z., Pecht, M.G. (2014). Thermal Reliability Tests. In: Copper Wire Bonding. Springer, New York, NY. https://doi.org/10.1007/978-1-4614-5761-9_5

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  • DOI: https://doi.org/10.1007/978-1-4614-5761-9_5

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  • Publisher Name: Springer, New York, NY

  • Print ISBN: 978-1-4614-5760-2

  • Online ISBN: 978-1-4614-5761-9

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