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Abstract

Cleaning electronic assemblies has caused heated debates for the past several years. Cleaning is done primarily for cosmetic and reliability reasons. Suppliers want products to look good. Customers want highly reliable products. A clean assembly implies, in many minds, a high reliability assembly.

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References

  1. Denyon, W., and Wargotz, W., and Turbini, L. 1990. Guidelines for Cleaning of Printed Boards and Assemblies, IPC-CH-65. Lincolnwood, IL: IPC.

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  2. Marcoux, P. 1992. PCA Design Guidelines Manual. Sunnyvale, CA: PPM Associates.

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  3. Morris, J. and Conway, J. No-Clean Reflow Process Implementation. In Circuits Assembly,Aug., 1991.

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  4. — 1991. Cleaning and Cleanliness Test Program, IPC-TR-580. Lincolnwood, IL: IPC.

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© 1992 Springer Science+Business Media New York

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Marcoux, P.P. (1992). Post Reflow Cleaning. In: Fine Pitch Surface Mount Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-3532-4_8

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  • DOI: https://doi.org/10.1007/978-1-4615-3532-4_8

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-0-442-00862-8

  • Online ISBN: 978-1-4615-3532-4

  • eBook Packages: Springer Book Archive

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