Abstract
The substrate, also referred to as the packaging and interconnecting structure, plays a crucial role in ensuring the electrical, thermal, and mechanical reliability of electronic assemblies. The term substrate can be defined in two categories: (1) laminate substrate. which is used to make the printed wiring hoard (PWB) or printed circuit board (PCB); (2) constraining substrate. which is used for decreasing the CTF (coefficient of thermal expansion) or increasing the thermal conduction. Unless we are specific, the term substrate could refer to either of these two categories. Before choosing from among the many types of substrate (of either category) that are available for military and commercial applications, however, it is necessary to determine the properties that will be required. Then a substrate material that meets all the requirements in a cost-effective manner can be selected.
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© 1997 Springer Science+Business Media Dordrecht
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Prasad, R.P. (1997). Substrates for Surface Mounting. In: Surface Mount Technology. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-4084-7_4
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DOI: https://doi.org/10.1007/978-1-4615-4084-7_4
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