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Plastic Packaging

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Microelectronics Packaging Handbook

Abstract

This chapter presents the information needed to design, manufacture and test microelectronic devices which are encapsulated in“plastic” molding compound. The chapter begins with an historical overview, then discusses advantages and disadvantages of plastic versus ceramic packaging. The next three sections present the materials, manufacturing processes for molding and the handling methods of the finished product. This is followed by a section on test and reliability issues. The chapter concludes with a view of the future of plastic encapsulated microcircuits. The interested reader is referred to the books titled“Plastic Encapsulated Microcircuits ” [1], and“Integrated Circuit, Hybrid and Multichip Module Design Guidelines” [2] for more detailed information.

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Authors and Affiliations

  1. University of Maryland, USA

    Michael G. Pecht

  2. National Semiconductor, India

    Luu T. Nguyen

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  1. Michael G. Pecht
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Editors and Affiliations

  1. Georgia Institute of Technology, USA

    Rao R. Tummala

  2. Rensselaer Polytechnic Institute, USA

    Eugene J. Rymaszewski

  3. AGK Enterprises, USA

    Alan G. Klopfenstein

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Pecht, M.G., Nguyen, L.T. (1997). Plastic Packaging. In: Tummala, R.R., Rymaszewski, E.J., Klopfenstein, A.G. (eds) Microelectronics Packaging Handbook. Springer, Boston, MA. https://doi.org/10.1007/978-1-4615-6037-1_4

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  • DOI: https://doi.org/10.1007/978-1-4615-6037-1_4

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4613-7767-2

  • Online ISBN: 978-1-4615-6037-1

  • eBook Packages: Springer Book Archive

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