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Process Reliability

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BiCMOS Technology and Applications

Part of the book series: The Springer International Series in Engineering and Computer Science ((SECS,volume 76))

Abstract

The reliability of BiCMOS process is a key issue in establishing its viability. Some concerns have been raised regarding the increased process complexity and the compatibility of fabricating CMOS and bipolar devices on the same chip. Performance and process tradeoffs are expected as these two device types are merged with minimal additional process steps. Therefore, it is imperative that device reliability issues are integrated with the process architecture and device design issues.

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Author information

Authors and Affiliations

  1. National Semiconductor Corporation, USA

    R. Lahri, S. P. Joshi & B. Bastani

Authors
  1. R. Lahri
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  2. S. P. Joshi
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  3. B. Bastani
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Editor information

Editors and Affiliations

  1. Aspen Semiconductor Corporation (A Cypress Semiconductor Company), Cuba

    A. R. Alvarez

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© 1990 Springer Science+Business Media New York

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Lahri, R., Joshi, S.P., Bastani, B. (1990). Process Reliability. In: Alvarez, A.R. (eds) BiCMOS Technology and Applications. The Springer International Series in Engineering and Computer Science, vol 76. Springer, Boston, MA. https://doi.org/10.1007/978-1-4757-2029-7_4

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  • DOI: https://doi.org/10.1007/978-1-4757-2029-7_4

  • Publisher Name: Springer, Boston, MA

  • Print ISBN: 978-1-4757-2031-0

  • Online ISBN: 978-1-4757-2029-7

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