Skip to main content
SpringerLink
Log in

Basics of Designing Structures of Printed Circuit Boards of High-Speed Electronic Devices

  • Chapter
  • First Online:
High-Speed Digital System Design

  • 1803 Accesses

Abstract

This chapter is devoted to the concerns and peculiarities of printed circuit boards’ structural designing for high-speed electronic devices. Designers of modern high-speed electronic devices, looking through the table of contents of the book, will almost certainly miss this chapter—well, what else is interesting and useful they can learn about printed circuit boards? Usually they choose numerous options of this class of products currently offered by the market and use them only as a kind of physical medium for the structural design of their device (apparatus, system) being designed.

This is a preview of subscription content, log in via an institution to check access.

Access this chapter

Log in via an institution
Chapter
USD 29.95
Price excludes VAT (USA)
  • Available as PDF
  • Read on any device
  • Instant download
  • Own it forever
eBook
USD 99.00
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Softcover Book
USD 129.99
Price excludes VAT (USA)
  • Compact, lightweight edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info
Hardcover Book
USD 199.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Purchases are for personal use only

Institutional subscriptions

References

  1. Johnson, H., & Graham, M. High speed digital design: A handbook of black magic.

    Google Scholar 

  2. Belous, A. I., & Emelyanov, V. A. (2013). Fundamentals of IC microassembly (p. 316). Moscow: DMK Press (in Russian).

    Google Scholar 

  3. 7 Key considerations for effective chip-package thermal co-design a high-level ‘how to’ guide mentor graphics, whitepaper. January, 2014.

    Google Scholar 

  4. State of automotive the art automotive thermal design by DENSO. Engineering Edge, 2(1), Mentor. Graphics Corp. 2013.

    Google Scholar 

  5. 10 Tips for streamlining PCB thermal design. A high-level “how to” guide Mentor Graphics white paper. January, 2014.

    Google Scholar 

  6. Kondratyev, V. (2016). Calculation of the thermal regime of the components. Electronic Components, 2, 17–24 (in Russian).

    Google Scholar 

  7. Bodnar, D. (2014). Metallic and composite heat-conducting materials for high-power semiconductor packages. Components and Technologies, 12, 155–160 (in Russian).

    Google Scholar 

  8. Eblen, M. (2006). Transient thermal modeling techniques for WBG device packaging. Duluth, GA: Kyocera.

    Google Scholar 

  9. Vladimirov, S. (2016). Features of the design of the transmission line on printed circuit boards. Electronic Components, 2, 30–33 (in Russian).

    Google Scholar 

  10. Belous, A. I., Merdanov, M. K., & Shvedov, S. V. (2016). Microwave electronics in radar systems and communications. Technical encyclopedia in 2 books. Moscow: Technosphere (in Russian).

    Google Scholar 

  11. Zhang, P. (Senior Design Engineer) & Morant, K. (Lead Design Engineer) (2016, January 12). Nuvation Engineering.

    Google Scholar 

  12. Vladimirov, S. (2015). Features of the topology of printed circuit boards for RF applications. Electronic Components, 3, 20–24 (in Russian).

    Google Scholar 

  13. Coondor, J., & Rogers Corporation. Understanding PCBS for high-frequency applications. Printed Circuit Design Fabrication.

    Google Scholar 

  14. Warner, J. (2012, March 9) How surface roughness impacts high-performance PCBS. Microwave Journal.

    Google Scholar 

  15. Savenko, S. (2016). Innovative trends in the technology of printed circuit boards. Technologies in the Electronics Industry, 7, 22–27 (in Russian).

    Google Scholar 

  16. Proceedings of the EPIC conferences, 2014–2016 (in Russian).

    Google Scholar 

  17. Zakharov, D. (2016). The integrity of signals in high-speed communication lines. Electronic Components, 8, 60–63 (in Russian).

    Google Scholar 

  18. Korotkov, S. (2016). Electromagnetic interference and signal integrity on printed circuit boards. Electronic Components, 5, 14–16 (in Russian).

    Google Scholar 

  19. Peresadin, A. (2016). Ensuring the integrity of signals at all stages of design. Electronic Components, 8, 26–31 (in Russian).

    Google Scholar 

  20. Gakharia, V., & Gakharia L. (2016). Analysis and calculation of delay lines in printed circuit boards of digital devices. Technologies in the Electronics Industry, 5, 6–11 (in Russian).

    Google Scholar 

  21. Brooks, D. (2004, January) Crosstalk effects in serpentine traces. Adjusting signal timing (part 2). UltraCAD Design.

    Google Scholar 

  22. Guo, W.-D., et al. (2004). Comparison between flat spiral and serpentine differential delay lines on TDR and TDT. In IEEE 13th topical meeting, electrical performance of electronic packaging (pp. 147–150).

    Google Scholar 

  23. IPC-2251 A standard developed by IPC-2003.

    Google Scholar 

  24. Feller, A., Kaupp, Н. R., & Digiacomo J. J. (1965). Crosstalk and reflections in highspeed digital systems. In Proceeding fail joint computer conference.

    Google Scholar 

  25. Wu, R. B., & Chao, F. L. (1995). Laddering wave in serpentine delay line. IEEE Transactions Components, Packaging and Manufacturing Technology B, 18(4), 644–650.

    Google Scholar 

  26. Kerinami, М. H., & Ramahi, О. M. (2003). Effects of segment length and number of turns on designing a precise meander delay line. In IEEE international symposium on electro-magnetic compatibility (Vol. 2).

    Google Scholar 

  27. Bogatin, E. (2003). Signal and power integrity- simplified. Prentice Hall.

    Google Scholar 

  28. Rubin, B. J. (2000). Study of meander line delay in circuit boards. IEEE Transactions on Microwave Theory and Techniques. 48(9).

    Article  Google Scholar 

  29. Soh, W.-S., See, K.-Y., Chang, R. W.-Y., Oswal, М., & Wang L.-B. (2009, December 7–10) Comprehensive analysis of serpentine line design. In Microwave conference. Asia Pacific: APMC.

    Google Scholar 

  30. Lee, H., & Kim, J. (2002). Unit cell approach to full- wave analysis of meander delay line using FDTD periodic structure modeling method. IEEE Transactions on Advanced Packaging, 25(2).

    Google Scholar 

  31. Shin, J., & Michalka, T. (2012). Comprehensive, scalable design guidance for serpentine time delay variation in digital system. In Electronic Components and Technology Conference (ECTC).

    Google Scholar 

  32. Krasnov, S. (2016). How to rneutralize undesirable effects from hanging vias. Electronic Components, 12, 17–21 (in Russian).

    Google Scholar 

  33. Оlnеу, В. How to Наndlе Dаnglеrs. iсоnnесt007.uberflip.соm

    Google Scholar 

  34. Мutnurу, B. М. Circuit board hаving holes to inсrеаsе rеsоnаnt frеquеnсу of via stubs. US 8542494 В2. IBM Соrроrаtiоn. https://patents.google.com/patent/US8542494B2

  35. Dorokhov, V. (2016). Empirical rules for designing the topology of boards with high-speed signals. Electronic Components, 12, 22–26 (in Russian).

    Google Scholar 

  36. Eric, B. Bogatin’s rules of Thumb. www.edn.com

  37. Medvedev, A. M. (2005). Printed circuit boards. Constructions and materials. Moscow: Technosphere (in Russian).

    Google Scholar 

Download references

Author information

Authors and Affiliations

  1. Integral, Minsk, Belarus

    Anatoly Belous & Vitali Saladukha

Authors
  1. Anatoly Belous
    View author publications

    You can also search for this author in PubMed Google Scholar

  2. Vitali Saladukha
    View author publications

    You can also search for this author in PubMed Google Scholar

Rights and permissions

Reprints and permissions

Copyright information

© 2020 Springer Nature Switzerland AG

About this chapter

Check for updates. Verify currency and authenticity via CrossMark

Cite this chapter

Belous, A., Saladukha, V. (2020). Basics of Designing Structures of Printed Circuit Boards of High-Speed Electronic Devices. In: High-Speed Digital System Design. Springer, Cham. https://doi.org/10.1007/978-3-030-25409-4_7

Download citation

  • DOI: https://doi.org/10.1007/978-3-030-25409-4_7

  • Published:

  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-030-25408-7

  • Online ISBN: 978-3-030-25409-4

  • eBook Packages: EngineeringEngineering (R0)

Publish with us

Policies and ethics

Search

Navigation