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Advances in Biomedical Sensor Systems for Wearable Health

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Hybrid ADCs, Smart Sensors for the IoT, and Sub-1V & Advanced Node Analog Circuit Design

Abstract

This book chapter will discuss advancements in analog circuit design specifically for various wearable healthcare applications. There are a number of general trends that can be observed in this field, like multimodal sensing applications, which will be discussed. There will be a focus on analog circuits for some of the most relevant signal modalities including ExG, bio-impedance, and photoplethysmogram (PPG). Common circuit topologies and some recent state-of-the-art implementations for those will be discussed.

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Authors and Affiliations

  1. imec, Heverlee, Belgium

    Nick Van Helleputte & Chris Van Hoof

  2. imec-Holst Centre, Eindhoven, The Netherlands

    Jiawei Xu, Hyunsoo Ha, Roland Van Wegberg, Shuang Song, Stefano Stanzione, Samira Zaliasl, Richard van den Hoven, Wenting Qiu, Haoming Xin, Chris Van Hoof & Mario Konijnenburg

Authors
  1. Nick Van Helleputte
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  2. Jiawei Xu
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  3. Hyunsoo Ha
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  4. Roland Van Wegberg
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  5. Shuang Song
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  6. Stefano Stanzione
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  7. Samira Zaliasl
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  8. Richard van den Hoven
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  9. Wenting Qiu
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  10. Haoming Xin
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  11. Chris Van Hoof
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  12. Mario Konijnenburg
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Corresponding author

Correspondence to Nick Van Helleputte .

Editor information

Editors and Affiliations

  1. Department of Electrical Engineering, Eindhoven University of Technology, Eindhoven, Noord-Brabant, The Netherlands

    Pieter Harpe

  2. Department of Microelectronics, Delft University of Technology, Delft, Zuid-Holland, The Netherlands

    Kofi A. A. Makinwa

  3. Department of Physics G. Occhialini, University of Milan, Milano, Italy

    Andrea Baschirotto

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Van Helleputte, N. et al. (2018). Advances in Biomedical Sensor Systems for Wearable Health. In: Harpe, P., Makinwa, K., Baschirotto, A. (eds) Hybrid ADCs, Smart Sensors for the IoT, and Sub-1V & Advanced Node Analog Circuit Design. Springer, Cham. https://doi.org/10.1007/978-3-319-61285-0_7

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  • DOI: https://doi.org/10.1007/978-3-319-61285-0_7

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  • Publisher Name: Springer, Cham

  • Print ISBN: 978-3-319-61284-3

  • Online ISBN: 978-3-319-61285-0

  • eBook Packages: EngineeringEngineering (R0)

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