Abstract
The present contribution reviews some recent results on the experimental characterisation of the nanoscale fracture toughness of silicon by using pre-cracked specimens and alternatively the theory of critical distances (TCD). Later, the results are discussed to provide the ultimate dimensional limit of the continuum fracture mechanics at the nanoscale in the light of sophisticated discrete atomic simulations at the onset of brittle fracture. The results show that the fracture toughness of Si is independent of the scale, crystal orientation and the singular stress field length. This confirms the atomistic nature of the brittle fracture. Moreover, the continuum fracture mechanics fails below a singular stress field approaching 2 nm.
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Acknowledgements
This work was supported by the Japan Society for the Promotion of Science (JSPS) International Research Fellow program (Grant No. 16F16366); JSPS KAKENHI (Grant No. JP15H02210, JP26630009, and JP25000012); JSPS Grant-in-Aid for Specially Promoted Research (Grant No. 25000012).
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Gallo, P., Sumigawa, T., Shimada, T., Yan, Y., Kitamura, T. (2019). Investigation into the Breakdown of Continuum Fracture Mechanics at the Nanoscale: Synthesis of Recent Results on Silicon. In: Gdoutos, E. (eds) Proceedings of the First International Conference on Theoretical, Applied and Experimental Mechanics. ICTAEM 2018. Structural Integrity, vol 5. Springer, Cham. https://doi.org/10.1007/978-3-319-91989-8_45
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