Abstract
For manufacturing a stable, reliable and durable microsystem, the designers must have the correct mechanical properties of materials which are used to prepare structural components before designing the Microsystems. It is well known that the mechanical properties of materials are not only depending on the materials composition, but also on its microstructure, manufacturing processes, and micro components size. Because the material’s properties that could be found in handbook are for bulk materials which are prepared by standard producing processes (for example: rolling, forging). But the micro components in Microsystems are manufactured by the way quite different from the macro components with bulk materials (for example: CVD, Sputtering, Etching). Therefore, the microsystem designer can not use the materials properties listed in handbook to design micro components.
Due to above reasons, there is a serious challenge of materials issue to MEMS designer. It is hardly to make sure that what correct materials properties should he picked up. To find the data from handbook is incorrect, but he could not also find the suitable data from literatures based on the dimensions and preparation processes of micro component he designed. In such case, the designer should measure the materials properties for important microparts by himself before designing MEMS system.
Hereby, before the material’s properties which are usually selected in Microsystems are introduced, this chapter will briefly descript the failure analysis of micro parts and the measuring methods of material’s mechanical properties from the micro components.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Muhistein C. L., E. A. Stach, and R. O. Ritchie, (2002), Mechanism of fatigue in micro-scale films of polycrystalline silicon for microelectromechanical systems, Applied Phys. Lett., 80(9): 1532–1534
Khoo H. S., K. K. Liu, and F. G. Tseng, (2003), Mechanical strength and interfacial failure analysis of cantilevered SU-8 microposts, J. of Micromech. Microeng., 13: 822–831
Greek. S. and S. Johansson, (1997), Tensile testing of thin film microstructure, Proc. SPIE, 3224: 344–351
Sharpe W. N., B. Jr. Yuan, and A. Edwarde, (1997), new technique for measuring the mechanical properties of thin film, J. of Microelectromechanical System, 6(3): 193–199
Li X. P., G. F. Ding, T. Ando, M. Shilkida, and K. Sato, (2007), Micromechanical characterization of electroplated permalloy films for MEMS, Microsystem Technology, 14: 131–134
Peterson K. E., and C. R. Guarnieri, (1979), Young’s modulus measurements of thin films using micromechanics, J. of Appl. Phys., 50(11): 6761–6766
Li X. X. et al., (2003), Ultrathin single crystalline silicon cantilever resonators: Fabrication technology and significant specimen size effect on Young’s modulus, Appl. Phys. Letters, 83(15): 3081–3083
Xiang Y., X. Chen, and J. J. Vlassak, (2002), The mechanical properties of electroplated Cu thin films measured by means of the Bulge test technique, Mat. Res. Symp. Proc. 695: L4.9.1–L4.9.5
Schneider D., J. Maibach, and E. Obermeier, (1995), New analytical solution for the load-deflection of square membranes, J. of Microelectromechanical Systems, 4(4): 238–241
Vlassak J. J., and W. D. Nix, (1992), New bulge test technique for the determination of Young’s modulus and Poisson’s ratio of thin film, J. of Materials Research, 7(12): 3242–3249
Allen M. G., and S. D. Senturia, (1987), Microfabricated structures for the measurement of adhesion and mechanical properties of polymer films, Proceedings of the ACS, 1987, Denver, CO, USA
Tabata O. et al., (1989), Mechanical property measurements of thin films using loaddeflection of composite rectangular membranes, Sensors and Actuators 20(1–2): 135–141
Ziebart V. at al., (1998), Mechanical properties of thin film from the load deflection of long clamed plates, J. of Microelectromechanical systems, 7(3): 320–328
Gad-el-Hak M., 2002 MEMS Handbook
He. J. H., Ph.D. Thesis, 2004, Cambridge University
Oliver W. C. and G. M. Pharr, (1992), Improved technique for determining hardness and elastic modulus using load and displacement sensing indentation experiments, J. Materials Research, 7(6): 1564–1580
Senturia S. D., (2001), Microsystem Design, Kluwer Academic Publishers
Wilson C. J., A. Ormeggi, and M. Narbutovskih, (1996), Fracture testing of silicon microcantilever beams, J. of Appl. Phys., 75(5): 2386–2393
Wilson C. J., P. A. Beck, (1996), Fracture testing of bulk silicon microcantilever beams subjected to a sideload. J. of Microelectromechanical Systems, 3(5): 142–150
Weihs T. P., et al., (1988), Mechanical deflection of cantilever microbeams: A new technique for testing the mechanical properties of thin film, J. of Materials Research, 3(5): 931–942
Nilsson S. G., E. L. Sarwe, and L. Montelius, (2003), Fabrication and mechanical characterization of ultrashort nanocantilevers, Appl. Phys. Letters, 83(5): 990–992
Denhoff M. W., (2003), A measurement of Young’s modulus and residual stress in MEMS bridge using a surface profiler, J. of Micromechanics and Microengineering, 5: 686–692
Zhang T.-Y. et al., (2000), Microbridge testing of silicon nitride thin films deposited on silicon wafers, Acta Materialia, 48(11): 2843–2857
Jones P. F., G. C. Johnson, and R. T. Howe, (1996), Micromechanical structures for fracture testing of brittle thin films, Proc. MEMS DSC-Volume 59, Atlanta, GA, November, 325–330
Sundararajan S., Ph.D. thesis, 2001, Ohio State University
Muhlstein C. L., S. B. Brown, and R. O. Ritchie, (a) High cycle fatigue and durability of polycrystalline silicon films in ambient air, Sensors and Actuators A, 2001, 94: 177–188 (b) A reactive-layer mechanism for the delayed failure of micro-scale polycrystalline silicon structural films subjected to high-cycle fatigue loading, Acta Materialia, 50, 2002, 3579-3595
Petersen K. E., (1982), Silicon as a mechanical material, Proc. of the IEEE, 70(5): 420–457
Jadaan O. M., et al., (2002), Probabilistic Weibull behavior and mechanical properties of MEMS brittle materials, J. of Materials Science, 38(20): 4087–4113
Brantley W. A., (1993), Calculated elastic constants for stress problems associated with semiconductor devices, J. of Appl. Physc., 44(1): 534–535
Greenwood J. C., (1998), Silicon in mechanical sensors, J. of Physics E: Scientific Instruments, 21(12): 1114–1128
Sato K., et al., (1998), Tensile testing of silicon film having different crystallographic orientations carried out on a silicon chip, Sensors and Actuators, 70(1–2): 148–152
Schweitz J. A., and F. Ericson, (1994), Evaluation of mechanical materials properties by means of surface micromachined structures, Sensors and Actuators, A: Physical, 74(1–3): 126–133
Yi T., et al., (2000), Microscale material testing of single crystalline silicon: Process effects on surface morphology and tensile strength, Sensors and Actuators A, Physical, 83(1): 172–178
Chasiotis I. and W. Knauss, (1998), Mechanical properties of thin polysilicon films by means of probe microscopy, Proc. of SPIE, 3512: 66–75
Tsuchiya T., O. Tabato, et al., (1998), Specimen size effect on tensile strength of surface micromachined polycrystalline silicon thin film, J. of Micromechanical Syst., 7: 106–113
Sharpe W., S. Brown, at el., (1998), Round-robin tests for modulus and strength of polysilicon, Proc. Microelectromechanical Structure for Materials Research, 1998(518), Materials Research Society Spring Meeting, San Francisco, CA, 4: 57–65
Madou M. J., (1997), Fundamentals of Microfabrication, 2: 53–87
Levy R. A., et al., (1996), Low pressure chemical vapor deposition of silicon nitride using the environmentally friendly tris(dimethylamino)silane pressure, J. of Materials Research, 11(6): 1483–1488
Bromley E. I., et al., (1983), Technology for the determination of stress in thin films, Proc. of the Int. Symp. on Electron, on and Photon Beams, 1(4): 1364–1366
Drummond C. J., and T. J. Senden, (1995), Characterization of the mechanical properties of thin film cantilever with the atomic force microscope, Materials Science Forum, 189–190: 107–114
Bhushan B., and B. K. Gupta, (1991), Handbook of tribology, Materials coatings and surface treatments, Reprint edition, 1991, Krieger, Malabar FL
Ericson F., et al., (1998), Hardness and fracture toughness of semiconducting materials studied by indentation and erosion techniques, Materials Science and Engineering, A, 105–106: 131–141
Tai Y. C., Parylene MEMS: Material technologies and applications, Proc. of the 20tth Sensor Symposium on Sensors, Micromachines, and Applied Systems, 2003, July 23–24, Tokyo, Japan, 1–8
Harder T. H., et al., (2002), Residual stress in thin film parylene, Proceedings, The Fifteenth IEEE International Conference on Micro Electro Mechanical Systems, Las Vegas, USA, 2002, 435–438
Shih J., et al., (2003), Surface micromachined and integrated capacitive sensors for microfluidic applications, Technical Digest, The 12th International Conference on Solid-State Sensors, Actuators, and Microsystems (Transducers’ 03), Boston, USA, 2003, 388–391
[46] Meng E., et al., (2003), A parylene MEMS flow sensing array, Technical Digest, The 12th International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers’ 03), Boston, USA, 2003, 686–689
Wang X. Q., et al., (1999), A parylene micro check valve, Proceedings, IEEE 12th International Micro Electro Mechanical Systems Conference (MEMS’ 99), Orlando, Florida, Jan. 1999, 177–182
Xie J., et al., (2003), Integrated surface micromachined mass flow controller, Proceedings, The Sixteenth IEEE International Conference on Micro Electro Mechanical Systems (MEMS’ 03), Kyoto, Japan, Jan. 2003, 20–23
Yao T. J., et al., (2002), Dielectric charging effects on parylene electrostatic actuators, Proceedings, The Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (MEMS’ 02), Las Vegas, USA., 2002, 614–617
Bhushan B., (2003), Adhesion and stiction: Mechanisms, measurement techniques, and methods for reduction, J. of Vac. Sci. Technol., 21(6): 2262–2295
Liu H., and B. Bhushan, (2002), Investigation of nanotribological properties of selfassembled monolayers with alkyl and biphenyl spacer chains, Ultramicroscopy, 91: 185–202
Delamarche E., at al., (1994), Thermal stability of self-assembled monolayers, Langmuirr, 10: 4103–4108
Srinivasan U., et al., (1998), Alkyltrichlorosilane-based self-assembled monolayer film for stiction reduction in silicon micromachines, J. Microelectromechanical Systems, 7(2): 252–260
Ahmed S. I., et al., (1999), Microtribological properties of self-assembled monolayers, www.iavf.de/pdf/deutsch, 1999, 1–8
Bhushan B., (1999), Chemical, mechanical, and tribological characterization of ultra-thin and hard amorphous carbon coating as thin as 3.5 nm: Recent developments, Diamond and Related Materials, 8: 1985–2015
Mayer T. M., et al., (2003), Atomic-layer deposition of wear-resistant coatings for microelectromechanical devices, Applied Phys. Letters, 82(17): 2883–2885
Aimi M. F., et al., (2004), High-aspect-ratio bulk micromachining of titanium, Nature Materials, 3: 103–105
Author information
Authors and Affiliations
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2012 Tsinghua University Press, Beijing and Springer-Verlag Berlin Heidelberg
About this chapter
Cite this chapter
Cai, B. (2012). Material Issues for Microsystems. In: Zhou, Z., Wang, Z., Lin, L. (eds) Microsystems and Nanotechnology. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-18293-8_3
Download citation
DOI: https://doi.org/10.1007/978-3-642-18293-8_3
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-18292-1
Online ISBN: 978-3-642-18293-8
eBook Packages: Chemistry and Materials ScienceChemistry and Material Science (R0)