Abstract
For the digital imaging system of solder joint defect detection of BGA device in the printed circuit board, the paper calculate the optimal imaging results by analyzing the effect of the ray source focal size on the imaging results. The superposition display of captured image achieves good real-time effects. By testing, the systemic resolution of optimal magnification achieves 17lp/mm, the minimum resolution of defect analysis accuracy achieves 0.03mm, and show the result picture of collection test.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
Wang, J., Tan, H., Huang, L., Xu, L.-B.: Design of Data Acquisition Transmission. Nuclear Electronics & Detection Technology 28(6), 1087–1090 (2008)
Zhang, Y.-Q., Wang, H.: A compact digital X-ray imaging system. Optics and Precision Engineering 16(4), 591–597 (2008)
Zhao, C.-Y., Zheng, Y.-G., Su, R.: Algorithm of Reducing Noise Based on Statistical Information of Multi-image. Journal of System Simulation 18(1), 383–384 (2006)
Kong, F.-Q.: Development and Application of the Microfocus Radiography. Nondestructive Testing 30(12), 931–933 (2008)
Hu, Y.-F.: X-Ray Detection for Soldered Joint Defects in BGA Package. Electronics Process Technology 26(6), 340–344 (2005)
Qu, Z.W., Wang, M.Q.: High Resolution Printed Circuit Board X-Ray Exmination System Nondestructive Testing 6, 438–439 (2010)
Author information
Authors and Affiliations
Corresponding author
Editor information
Editors and Affiliations
Rights and permissions
Copyright information
© 2012 Springer-Verlag Berlin Heidelberg
About this paper
Cite this paper
Zhang, W., Zhang, X.L. (2012). BGA Device Detection System Based on Frame Integral Reducing Noise Method. In: Deng, W. (eds) Future Control and Automation. Lecture Notes in Electrical Engineering, vol 173. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-31003-4_43
Download citation
DOI: https://doi.org/10.1007/978-3-642-31003-4_43
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-642-31002-7
Online ISBN: 978-3-642-31003-4
eBook Packages: EngineeringEngineering (R0)