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Robust 3D Radio Sensor Systems with Embedded Active and Passive Components for Industrial Applications

  • Conference paper
Green and Smart Technology with Sensor Applications (ICTSM 2011, SIA 2012, GST 2012)

Part of the book series: Communications in Computer and Information Science ((CCIS,volume 338))

  • 1795 Accesses

Abstract

Future miniaturized wireless sensor nodes will increasingly support the coordination of production processes and provide substantial cost savings as part of condition-based maintenance. Production processes can be made ​​much more flexible. A modular assembly concept has been developed for industrial environments. Module integration technologies for embedding electronic components into the substrate offer particular advantages for the design of small wireless sensor systems. However, several challenges arise during the module layout. An example of industrial sensors for condition monitoring illustrates how to implement fully functional prototypes.

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Author information

Authors and Affiliations

  1. Fraunhofer Institute for Reliability and Microintegration, Gustav-Meyer-Allee 25, 13355, Berlin, Germany

    Michael Niedermayer, Thomas Bonim & Stephan Guttowski

  2. Technical University Berlin Center of Advanced Packaging, Gustav-Meyer-Allee 25, 13355, Berlin, Germany

    Hendrik Scholtz & Klaus-Dieter Lang

Authors
  1. Michael Niedermayer
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  2. Hendrik Scholtz
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  3. Thomas Bonim
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  4. Stephan Guttowski
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  5. Klaus-Dieter Lang
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Editor information

Editors and Affiliations

  1. Chungwoon University, 350-701, Chungnam, Republic of Korea

    Hyun-seob Cho  & Keun-Wang Lee  & 

  2. GVSA and University of Tasmania, 20 Virginia Court, Hobart, TAS, Australia

    Tai-hoon Kim

  3. Lakehead University, ATAC 5013, 955 Oliver Road, P7B 5E1, Thunder Bay, Ontario, Canada

    Sabah Mohammed

  4. The Ohio State University, 4198 Graves Hall 333 W. 10th Avenue, 43210, Columbus, OH, USA

    Hojjat Adeli

  5. Hyejeon University, Hongseong-eup, Hongseong-gun, Chungnam-do, Republic of Korea

    Myoung-kwan Oh

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© 2012 Springer-Verlag Berlin Heidelberg

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Niedermayer, M., Scholtz, H., Bonim, T., Guttowski, S., Lang, KD. (2012). Robust 3D Radio Sensor Systems with Embedded Active and Passive Components for Industrial Applications. In: Cho, Hs., Kim, Th., Mohammed, S., Adeli, H., Oh, Mk., Lee, KW. (eds) Green and Smart Technology with Sensor Applications. ICTSM SIA GST 2011 2012 2012. Communications in Computer and Information Science, vol 338. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-35251-5_47

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  • DOI: https://doi.org/10.1007/978-3-642-35251-5_47

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-35250-8

  • Online ISBN: 978-3-642-35251-5

  • eBook Packages: Computer ScienceComputer Science (R0)

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