Summary
This paper presents a monolithically integrated multi-sensor system for the intelligent data carrier(IDC). The system includes a three-dimensional accelerometer, pressure sensor, temperature sensor and humidity sensor as well as the peripheral circuitry for each sensor on one chip. The peripheral circuitry was designed to combine them to one-chip microprocessor with A/D converter. The monolithic multi-sensor chip was realized using an SOI wafer, where the Deep-RIE bulk-micromachining process and bipolar IC process were used for sensor device fabrication and circuit fabrication, respectively.
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References
Hiroyuki Minakami, Masayoshi Kubo, Kazusuke Maenaka, Tatehiko Miki, “Research and Development of the Intelligent Data Carrier”, 6th World Conf. on Intelli. Trans. Systems, ITSA-003052, 8–12 Nov., Toront, (1999).
Microchip technology Inc. (<http://www.microchip.com/>)
P.R. Gray and R.G. Mayer, “Analysis and Design of Analog Integrated Circuits”, Wiley, 1990.
Arum Han, Kwang W. Oh, Shekhar Bansali, H. Thurman Henderson, Chong H. Ahn, “A Low Temperrature Biochemically Compatible Bonding Technique Using Fluoropolymers For Biochemical Microfluidic Systems”, The 13th Annual Int. Conf. on Micro Electro Mechanical Systems, PP. 414–418 (2000).
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© 2001 Springer-Verlag Berlin Heidelberg
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Fujita, T., Inoue, K., Tsuchitani, A., Arita, S., Maenaka, K. (2001). Integrated multi-sensor system for intelligent data carrier. In: Obermeier, E. (eds) Transducers ’01 Eurosensors XV. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-59497-7_20
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DOI: https://doi.org/10.1007/978-3-642-59497-7_20
Publisher Name: Springer, Berlin, Heidelberg
Print ISBN: 978-3-540-42150-4
Online ISBN: 978-3-642-59497-7
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