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Light Detection Using High-T c Microstrip Lines

  • Conference paper
Superconducting Devices and Their Applications

Part of the book series: Springer Proceedings in Physics ((SPPHY,volume 64))

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Abstract

We have measured the effect of light on the transmission of microwaves through YBa2 Cu3O7−δ microstrip lines. The microstrip line geometries discussed include meander paths and an asymmetric ring interferometer in which a metallic segment has been introduced in the shorter leg of the interferometer. The photoresponse measurements performed on the meander paths allow the probing of the spatial homogeneity of the microwave properties of the superconducting film. The destructive interference nulls for superconductor—metal asymmetric ring interferometer were observed to shift with microwave frequency due to the kinetic inductance effect; the depth of the nulls were observed change rapidly with changing temperature due to the different dependencies of the surface resistance for the superconductor and metal component parts.

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Author information

Authors and Affiliations

  1. Naval Research Laboratory, Washington, DC, 20375, USA

    J. C. Culbertson, H. S. Newman, U. Strom, J. M. Pond, D. B. Chrisey, J. S. Horwitz & S. A. Wolf

Authors
  1. J. C. Culbertson
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  2. H. S. Newman
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  3. U. Strom
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  4. J. M. Pond
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  5. D. B. Chrisey
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  6. J. S. Horwitz
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  7. S. A. Wolf
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Editor information

Editors and Affiliations

  1. Institut Berlin, Physikalisch-Technische Bundesanstalt, Abbestraße 2-12, W-1000, Berlin 10, Fed. Rep. of Germany

    Hans Koch  & Heinz Lübbig  & 

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© 1992 Springer-Verlag Berlin Heidelberg

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Culbertson, J.C. et al. (1992). Light Detection Using High-T c Microstrip Lines. In: Koch, H., Lübbig, H. (eds) Superconducting Devices and Their Applications. Springer Proceedings in Physics, vol 64. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-77457-7_30

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  • DOI: https://doi.org/10.1007/978-3-642-77457-7_30

  • Publisher Name: Springer, Berlin, Heidelberg

  • Print ISBN: 978-3-642-77459-1

  • Online ISBN: 978-3-642-77457-7

  • eBook Packages: Springer Book Archive

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