Abstract
This chapter presents the integration of a 60GHz amplifier and an antenna in a printed circuit-board (PCB) technology. The materials that are used for the realization of the PCB package are discussed. The implementation of flip-chip interconnection between the amplifier and the PCB is presented. The measurement results of the flip-chip integration are presented and discussed.
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© 2011 Springer Science+Business Media B.V.
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Yu, Y., Baltus, P.G.M., van Roermund, A.H.M. (2011). Flip-Chip Integration. In: Integrated 60GHz RF Beamforming in CMOS. Analog Circuits and Signal Processing, vol 1. Springer, Dordrecht. https://doi.org/10.1007/978-94-007-0662-0_8
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DOI: https://doi.org/10.1007/978-94-007-0662-0_8
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-007-0661-3
Online ISBN: 978-94-007-0662-0
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