Abstract
A perspective and review of the current state-of-the-art in cooling for high performance computers is provided. The trend towards higher power dissipation at both chip and module level is discussed, along with the corresponding need to reduce internal and external thermal resistance. The nature of the multi-chip module (MCM) cooling problem is discussed. The evolution of the IBM Thermal Conduction Module cooling design is described, along with examples of other recent high performance MCM cooling designs providing low thermal resistance(s). The relative package cooling effectiveness of these designs is presented in terms of “package thermal resistivity.”
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© 1994 Springer Science+Business Media Dordrecht
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Chu, R.C., Simons, R.E. (1994). Cooling Technology for High Performance Computers: Design Applications. In: Kakaç, S., Yüncü, H., Hijikata, K. (eds) Cooling of Electronic Systems. NATO ASI Series, vol 258. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-1090-7_4
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DOI: https://doi.org/10.1007/978-94-011-1090-7_4
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