Abstract
Cleaning electronic hardware to remove contaminants resulting from handling and assembly operations has long been a standard practice. The level of cleaning required often is governed by aesthetic (visual), electrical test, and performance requirements. Several of the criteria/requirements discussed herein relate to the manufacture of military electronic hardware, however, many are pertinent to the production of any high quality/high reliability equipment regardless of the customer or end-item use. The materials and processes used are governed by the type of product to be cleaned, the contaminants being removed, and the compatibility of the cleaning system with the product and the environment.
This is a preview of subscription content, log in via an institution to check access.
Access this chapter
Tax calculation will be finalised at checkout
Purchases are for personal use only
Preview
Unable to display preview. Download preview PDF.
References
DeNoon, R., and W. Hobson. 1972. “Printed Wiring Assemblies: Detection of Ionic Contaminants on.” Report No. 3-72, Naval Avionics Facility.
Anon. 1988. “Surface Organic Contaminant Detection Test (In-House Method).” Test Method Number 2.3.38, Revision A. The Institute for Interconnecting and Packaging Electronic Circuits, February.
Anon. 1988. “Surface Organic Contaminant Identified Test Infrared Analytical Method”. Test Method Number 2.3.39, Revision A. The Institute for Interconnecting and Packaging Electronic Circuits, February.
Wittmer, P., and B. Bonner. “Rational and Methodology for a Standard Residual Rosin Test by UV-Visible Spectrophotometric Methods.” Magnavox Electronic Systems, Co. Fort Wayne, Indiana.
Anon. 1986. “Post Solder Aqueous Cleaning Handbook.” ANSI/IPC-AC-62. The Institute for Interconnecting and Packaging Electronic Circuits, December.
Anon. 1987. “Post Solder Solvent Cleaning Handbook.” ANSI/IPC-SC-60. The Institute for Interconnecting and Packaging Electronic Circuits, April.
Hayes, M. 1989. “Terpenes: A Halogen-Free CFC Alternative.” Paper read at Proceedings of Electronics, CFCs and Stratospheric Ozone Conference, San Jose, California, February.
Hayes, M. 1988. “Chlorinated and CFC Solvent Replacement in the Electronics Industry: The Terpene Hydrocarbon Alternative.” Petroferm, Inc., February.
Johnson, K., and D. Sanger. 1983. “A Study of Solvent and Aqueous Cleaning of Fluxes,” NWC-TP-6427. Naval Weapons Center, China Lake, California.
DeNoon, R., and W. Hobson. 1978. “Review of Data Generated with Instruments Used to Detect and Measure Ionic Contaminants in Printed Wiring Assemblies.” Materials Research Report Number 3-78, Naval Avionics Center.
Gorondy, Emery I. 1984. “Surface Insulation Resistance—Part I: The Development of an Automated SIR Measurement Technique,” IPC-TP-518.
Gorondy, Emery I. 1985. “Surface Insulation Resistance—Part U: Exploring the Correlation Between Standard Industry and Military’ sIR’ Test Patterns—A Status Report.” IPC-TP-543.
Gorondy, Emery I. 1988. “Surface/Moisture Insulation Resistance (SIR/MIR)—Part HI: Analysis of the Effect of Test Parameters and Environmental Conditions on Test Results.” Presented at IPC Conference, Anaheim, California, October.
Chan, A. S. L., and T. A. Shankoff. 1988. “A Correlation between Surface Insulation Resistance and Solvent Extract Conductivity Cleanliness Tests.” Circuit World, 14 (November), 23–26.
Archer, W., T. Cabelka, and J. Nalazek. “Quantitative Determination of Rosin Residues on Cleaned Electronic Assemblies,” NWC-TP-6789. Available from Naval Weapons Center, Ridgecrest, California.
Wittmer and Bonner, op. cit.
Anon. 1987. Montreal Protocol on Substances that deplete the Ozone Layer (Final Act) United Nations Environmental Program.
U. S. National Aeronautics and Space Administration. 1988. “Present State of Knowledge of the Upper Atmosphere 1988: An Assessment Report.” Washington, D. C, August.
Anon. 1989. “Scientific Assessment of Stratospheric Ozone: 1989.” Appendix AFEAS Report, United Nations Environmental Program/World Meterological Organization, September.
Yamabe, M. 1989. “HCFC-225ca and 225cb as Alternatives to CFC-113.” Presented at The International Conference on CFC and Halon Alternatives, Washington, D.C., October.
Anon. 1989. International Conference on CFC and Halon Alternatives Washington, D.C., October 10–11.
Ibid.
Author information
Authors and Affiliations
Editor information
Rights and permissions
Copyright information
© 1991 Van Nostrand Reinhold
About this chapter
Cite this chapter
Felty, J.R. (1991). Defluxing for High Reliability Applications and General Environmental Issues. In: Hymes, L. (eds) Cleaning Printed Wiring Assemblies in Today’s Environment. Springer, Dordrecht. https://doi.org/10.1007/978-94-011-6967-7_6
Download citation
DOI: https://doi.org/10.1007/978-94-011-6967-7_6
Publisher Name: Springer, Dordrecht
Print ISBN: 978-94-011-6969-1
Online ISBN: 978-94-011-6967-7
eBook Packages: Springer Book Archive