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Fatigue Crack Growth Analysis of an Interfacial Crack in Heterogonous Material Using XIGA

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Mathematical Analysis of Continuum Mechanics and Industrial Applications II (CoMFoS 2016)

Part of the book series: Mathematics for Industry ((MFI,volume 30))

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Abstract

In the present work, the fatigue crack growth analysis of an interfacial cracked plate has been performed by extended isogeometric analysis (XIGA). In isogeometric analysis (IGA), non-uniform rational B-splines (NURBS) are employed for defining the geometry as well as the solution. In XIGA, the merits of isogeometric analysis and extended finite element method are combined together for analyzing the cracked geometries. The crack faces are modeled by discontinuous Heaviside jump function, whereas the singularity in the stress field at the crack tip is modeled by crack-tip enrichment functions. The values of stress intensity factors (SIFs) for the interface cracks are evaluated by XIGA and XFEM. Paris law is employed for computing the fatigue life of an interfacial cracked plate.

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Authors and Affiliations

  1. Department of Mechanical and Industrial Engineering, Indian Institute of Technology Roorkee, Roorkee, Uttarakhand, India

    Indra Vir Singh

  2. Mechanical Engineering Department, Thapar University, Patiala, Punjab, India

    Gagandeep Bhardwaj

Authors
  1. Indra Vir Singh
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  2. Gagandeep Bhardwaj
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Correspondence to Indra Vir Singh .

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Editors and Affiliations

  1. Kanazawa University, Kanazawa, Ishikawa, Japan

    Patrick van Meurs

  2. Kanazawa University, Kanazawa, Ishikawa, Japan

    Masato Kimura

  3. Kanazawa University, Kanazawa, Ishikawa, Japan

    Hirofumi Notsu

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Singh, I.V., Bhardwaj, G. (2018). Fatigue Crack Growth Analysis of an Interfacial Crack in Heterogonous Material Using XIGA. In: van Meurs, P., Kimura, M., Notsu, H. (eds) Mathematical Analysis of Continuum Mechanics and Industrial Applications II. CoMFoS 2016. Mathematics for Industry, vol 30. Springer, Singapore. https://doi.org/10.1007/978-981-10-6283-4_2

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  • DOI: https://doi.org/10.1007/978-981-10-6283-4_2

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-10-6282-7

  • Online ISBN: 978-981-10-6283-4

  • eBook Packages: EngineeringEngineering (R0)

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