Abstract
Package-on-package (PoP) has been used for housing the application processor (AP) chipset for a few years as shown in Fig. 2.17. Usually, the top package is used to house the mobile memory and the bottom package is used to house the AP. STATS ChipPAC proposed a PoP for the AP chipset with the FOWLP technology (Eslampour et al in IEEE/ECTC proceedings, 1946–1950, [1]; Yoon et al. in Proceedings of IEEE/ECTC, 1250–1254, [2]).
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Lau, J.H. (2018). FOWLP: PoP. In: Fan-Out Wafer-Level Packaging. Springer, Singapore. https://doi.org/10.1007/978-981-10-8884-1_8
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DOI: https://doi.org/10.1007/978-981-10-8884-1_8
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