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Pool Boiling Using Nanofluids: A Review

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Advances in Fluid and Thermal Engineering

Part of the book series: Lecture Notes in Mechanical Engineering ((LNME))

Abstract

Nanofluids have found their applications in various fields of heat transfer and their demand in various industries in ever growing. Pool boiling of nanofluids has always been a topic of great interest and research. In past years, a lot of experimental works have been done on various nanofluids and base fluid solutions to study about the influence of nanofluids on critical heat flux and heat transfer coefficient. Through these works, various factors such as surface roughness, wettability, contact angle, and particle deposition have also been studied as how these factors influence CHF. This paper also focuses on the past work and studies done on nanofluid pool boiling comprising of the very existing data.

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Author information

Authors and Affiliations

  1. ASET, Amity University, Noida, Uttar Pradesh, India

    Sumit Krishn, Mukund Goyal, Gopal Nandan & Anoop Kumar Shukla

  2. ME Department, Thapar University, Patiala, Punjab, India

    Satish Kumar

  3. NIT Jamshedpur, Jamshedpur, Jharkhand, India

    P. Kumar

Authors
  1. Sumit Krishn
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  2. Mukund Goyal
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  3. Gopal Nandan
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  4. Satish Kumar
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  5. P. Kumar
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  6. Anoop Kumar Shukla
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Corresponding author

Correspondence to Gopal Nandan .

Editor information

Editors and Affiliations

  1. Oak Ridge Institute for Science and Education, Oak Ridge, TN, USA

    Pankaj Saha

  2. Department of Mechanical Engineering, Indian Institute of Technology Delhi, New Delhi, Delhi, India

    P.M.V. Subbarao

  3. Department of Mechanical Engineering, Amity School of Engineering and Technology, Amity University Uttar Pradesh, NOIDA, Uttar Pradesh, India

    Basant Singh Sikarwar

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Krishn, S., Goyal, M., Nandan, G., Kumar, S., Kumar, P., Shukla, A.K. (2019). Pool Boiling Using Nanofluids: A Review. In: Saha, P., Subbarao, P., Sikarwar, B. (eds) Advances in Fluid and Thermal Engineering. Lecture Notes in Mechanical Engineering. Springer, Singapore. https://doi.org/10.1007/978-981-13-6416-7_31

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  • DOI: https://doi.org/10.1007/978-981-13-6416-7_31

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  • Publisher Name: Springer, Singapore

  • Print ISBN: 978-981-13-6415-0

  • Online ISBN: 978-981-13-6416-7

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