Abstract
The air conditioning in data center should be running in cold mode throughout the year account for amount of heat released in a relatively small space of rack. However, most of the heat in data center is released from electronic chips. Thus, the energy consumption of air conditioning will be significantly decreased if the heat released by electronic chips can be mitigated directly. Compared to the air cooling heat sink (ACHS), the cooling performance of liquid cooling heat sink (LCHS) is dramatically improved as it can remove more heat from the surface of electronic chip quickly. To further improve the cooling performance of LCHS, the effects of channel deployment are investigated in a commonly used S-shaped LCHS in this study. The numerical simulation results show that the average surface temperature of electronic chip can be reduced by 22.91 °C while the number of channels is increased from one to five.
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Acknowledgements
This work is supported by grants from the National Natural Science Foundation of China (No. 51878342) and Jiangsu Provincial Department of Housing and Urban Rural Construction (No. 2018ZD067).
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Lu, Z., Zhang, K., Liu, J. (2020). Study on the Effects of Channel Deployment in a S-Shaped Liquid Cooling Heat Sink for Electronic Chip Cooling. In: Wang, Z., Zhu, Y., Wang, F., Wang, P., Shen, C., Liu, J. (eds) Proceedings of the 11th International Symposium on Heating, Ventilation and Air Conditioning (ISHVAC 2019). ISHVAC 2019. Environmental Science and Engineering(). Springer, Singapore. https://doi.org/10.1007/978-981-13-9520-8_10
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