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In electroforming metal is deposited electrolytically upon the cathode-polarized electrode of an electrochemical cell. Unlike electroplating in which the deposited metal has to adhere to the cathode after electrolysis, in electroforming much thicker coatings are applied, the plating is performed on a cathode, and the surface of which bears a nonconducting film so that the deposited metal can be subsequently removed to yield a free-standing artifact or structural component.
Theory and Application
History
Electroforming was discovered by Jacobi in Russia in 1838. During his investigations of galvanic cells, he used an engraved copper printing plate as the cathode with a copper sulfate solution and electrodeposited copper upon it. Although he had difficulty separating the electrodeposit from the engraved printing plate, the deposit had accurately reproduced the details engraved in the original plate. In 1842, Boettger of Germany...
References
McGeough JA, Rasmussen H (1981) Theoretical analysis of the electroforming process. J Mech Eng Sci 23(3):113–120
McGeough J, Leu MC, Rajurkar KP, De Silva AKM, Liu Q (2001) Electroforming process and application to micro/macro manufacturing, keynote paper. CIRP Ann Manuf Technol 50(2):499–514
Spiro P (1968) Electroforming: a comprehensive survey of theory, practice and application. Draper, Teddington
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McGeough, J.A. (2018). Electroforming. In: The International Academy for Production (eds) CIRP Encyclopedia of Production Engineering. Springer, Berlin, Heidelberg. https://doi.org/10.1007/978-3-642-35950-7_6479-3
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DOI: https://doi.org/10.1007/978-3-642-35950-7_6479-3
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Publisher Name: Springer, Berlin, Heidelberg
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